It is sometimes referred to as glass ceramics because its composition consists of glass and aluminum.
Ltcc ceramic package.
Ltcc substrate with embedded passive components.
Ceramic packages and optical filters for image sensors.
Ceramic packages for light emitting diodes leds ltcc packages for rf modules.
High reliability ceramic substrates ltcc htcc.
Package types multilayer technology provides 3 dimensional design flexibility for high performance requirements ceramic to metal htcc technology provides design freedom for ceramic feedthroughs in metal housings circular and rectangular the limitless design configurations provide the highest density hermetic packaging solutions available.
Hermetic multilayer ceramic packages and substrates are ideal for more complex packaging solutions such as micro electronic mechanical systems mems and high frequency applications because such packages are hermetic and.
High lead count packages.
The multilayer ceramic is co fired at high temperatures to form a solid and hermetic ceramic.
2 3 low cost multilayer ceramic package for flip chip mmic up to w band.
Ltcc also features the ability to embed passive elements such as resistors capacitors and inductors into the ceramic package minimising the size of the completed module.
Components for fiber optic connectors.
Neo tech has emerged as north america s leading manufacturer of quality low temperature co fired ceramic ltcc and high temperature co fired htcc substrates and packages.
Ausn eutectic process steps.
Agcu eutectic or low temperature soldering e g.
Ceramic packages for power electronics.
They offer excellent resistance to the shock of drop testing and are well suited as module substrate materials in mobile communication devices.
Surface mount ceramic packages for electronic devices.
These fabrication technologies provide unique solutions for high interconnect density compact networks and high.
A low cost multilayer low temperature co fired ceramic ltcc package based on a mass production design rule for an mmic up to w band has been developed.
Htcc components generally consist of multilayers of alumina or zirconia with platinum tungsten and molymanganese metalization.
For htcc a final metal coating e g.
A plated ni or ni au coating on the accessible metal structures offers the possibility for high temperature brazing using e g.
Ceramic packages for automotive electronics.
Optical packages htcc is a practical choice or optical applications packages due to hermeticity flatness capability and stable over a wide temperature range.
Schott is also able to supply low temperature cofired ceramic ltcc housings through its partnership with via electronic.
Ceramic packages for mems sensors.
High strength materials ltcc hard.
The package structure includes a cavity for the flip chip mmic and improved coplanar feed through to suppress radiation.
